Toshiba
Western Digital introduces world’s first 512 Gb 64-layer 3D NAND chip
Western Digital Corp commences pilot production of the 512 Gigabit (Gb) three-bits-per-cell (X3) 64-layer 3D NAND (BICS3) chip in Yokkaichi, Japan.
Toshiba Medical Systems Corp sets up JV subsidiary in Malaysia
Japanese giant Toshiba's TMSC subsidiary has established Toshiba Medical Systems Malaysia Sdn Bhd as a joint venture corporation with TMSC's distributor in Malaysia, Abex Medical System Sdn Bhd.
